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BGA Reballing Stencil Kit for DJI H3 CPU IC Chip Tin planting platform direct heating BGA template
BGA Reballing Stencil Kit for DJI H3 CPU IC Chip Tin planting platform direct heating BGA template
BGA Reballing Stencil Kit for DJI H3 CPU IC Chip Tin planting platform direct heating BGA template
BGA Reballing Stencil Kit for DJI H3 CPU IC Chip Tin planting platform direct heating BGA template

BGA Reballing Stencil Kit for DJI H3 CPU IC Chip Tin planting platform direct heating BGA template

(5.0)
€ 12.16    45% off
€ 6.69
Out Of Stock

Goedkope en kortingen BGA Reballing Stencil Kit for DJI H3 CPU IC Chip Tin planting platform direct heating BGA template groothandel. Koop rechtstreeks bij verkoper SAYTOOL Store. Geniet van ✓Gratis verzending wereldwijd! ✓90 dagen kopersbescherming. ✓ Gemakkelijk retourneren. ✓ Geld-terug-garantie.

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